|
RF
probing
Updated September
5, 2006
Click
here to go to our main microwave measurements page
New for September 2006!
RF probing is an awesome way to measure the response of very small
devices, while not harming them!
.
Microwave probe
station

RF probe
History
of RF probes
Reed Gleason invented the first
high-frequency wafer probes with Eric Strid in 1980 while working
at Tektronix, and co-founded Cascade Microtech in 1983. This company
basically started an entire industry. Before RF probes were available,
there was literally no way to test MMIC devices on wafer, or for
that matter, without mounting them, wirebonding them. So there was
no way to produce known-good die for assembly. Thanks, guys! This
is reason enough to put them in the Microwave
Hall of Fame!
Early RF probes used coplanar
ceramic feeds, which where not very forgiving if they were lowered
just a few mils too too far (ceramic doesn't bend well!) Today many
styles are available, probe stations are more elaborate, life just
keeps getting better. The first probes covered up to 18 GHz. Now
easily cover up to 110 GHz!
De-embedding techniques had been
developed prior to probing, and often used break-apart test fixtures
with standards that had to be wire-bonded to the fixture halves.
Some day we'll try to post some of the math that is used in de-embedding
measurements. Anyone care to help us out?
Types of
probes
In order to probe a circuit you
need to launch a signal into it with some type of transmission line,
usually fifty ohms. This requires at least two conductors, the "signal"
conductor and the "ground" conductor. Three styles of
probes are shown below:

Ground-signal-ground is the most
common type of RF probe. This is similar to coplanar waveguide.
Ground signal probes are also
available. This probe would be needed if your RF circuit only had
one ground pad. Why would you do that? On GaAs, every square millimeter
can cost a dollar or more in high volume production. Probe pads
take up area, they cost money. In order to make the lowest price
product, sometimes that second ground pad doesn't get past the final
design review.
TriQuint seems to have the most
diverse probe patterns of all of the MMIC suppliers. Here's three
amplifiers we borrowed from the TriQuint web site. Here's the TGA4042
Q-band amplifier, it uses ground-signal-ground probe pads at input
and output.

Here's a TGA2501 6-18 GHz amplifier.
It uses GS on the input, and SG on the output.

And here's a TGA4506 Ka-band
amplifier. It uses GS on both sides! We don't recommend using anything
but GSG at this frequency and above, even if the TriQuint cowboys
do it routinely. Those TriQuint production testers must be kept
very busy swapping probes back and forth with every wafer that comes
out!

So what happens if you mix up
a GS probe with a GS probe? When the signal and grounds are swapped,
you get bad data. For example, gain measurements (S21) might be
20 dB low!
Most RF probes are 50 ohm impedance,
as is almost all microwave test equipment. However, sometimes high-impedance
probes are used in order to "sniff" out the performance
of a circuit without loading it down. Differential probes are also
possible, and dual-signal probes (SGS) are too. Can't say we've
ever seen either of these.
Known-good die (KGD)
After RF probing and the wafer is diced, when you sort out the parts
that met spec, these are the KGD.
Probe pitch
This is the distance between center-to-center of the probe tips. Typical
values are 150, 250 microns, but a range of 50 to 1000 microns is
possible. The larger probe pitch is not practical for millimeter-wave
frequencies.
Probe stations
More to come!
Probe skate
When you adjust the Z-axis of a probe, just as it comes in contact
with the DUT it will start to move in the Z-Y plane as it flexes.
You want the probe to skate probe just one mil (25 um). This is
usually accomplished by overtravel of 2 mils (50 um).
These images are used with permission
of Professor Kuhn at Kansas State. Thanks!


De-embedding
De-embedding means to mathematically
remove the effects of external transmission lines in order to arrive
at the true vector S-parameters of a device that is not connectorized.
The opposite of "de-embedded"
is not "un-de-embedded", it's "embedded!"
And please don't spell the word
de-imbedded, that's just wrong!
OK, this section is lame, we'll
work on it.
Coming soon: calibration standards!
|